ANSWERS TO QUESTIONS Q1. THROUGH Q36.

A1. Conformal coating.
A2. Chemical, mechanical, and thermal.
A3. Solvents or xylene and trichloroethane.
A4. Mechanical.
A5. To ensure protective characteristics are maintained.
A6. Interfacial connections.
A7. Clinched lead, straight-through, and offset pad.
A8. Above-the-board termination.
A9. On-the-board termination.
A10. During disassembly or repair.
A11. Wicking.
A12. Continuous vacuum.
A13. These methods should not be used.
A14. Manufacturer's standards.
A15. A fine abrasive.
A16. 90 degrees.
A17. They should be readable from a single point.
A18. In the direction of the run.
A19. The ease with which molten solder wets the surfaces of the metals to be joined.
A20. Conductive-type soldering iron.
A21. The type of work to be done.
A22. A thermal shunt.
A23. Bright and shiny with no cracks or pits.
A24. If the component is known to be defective or if the board may be damaged by normal desoldering.
A25. By pushing it gently out of the board.

A26. Heat each lead and lift with tweezers.
A27. Use a skipping pattern.
A28. Inspect and test.
A29. Operational failures, repairs by untrained personnel, repair using improper tools,mishandling, improper shipping, packaging, and storage.
A30. Clinched staple.
A31. Epoxy a replacement pad to the board, set an eyelet, and solder it.
A32. Repairs by untrained personnel and technicians using improper tools.
A33. Epoxy and fiberglass powder.
A34. Esd, improper stowage, and improper handling.
A35. To discharge any static charge built up in the body.
A36. Deviation from prescribed safe operating procedures.